Filtronic has finalised a multi-year programme to create plastic QFN packaging for Gallium Nitride devices, strengthening the UK’s position in advanced semiconductor manufacturing. The work, completed in August 2025, received part-funding through the Defence and Security Accelerator’s Defence Technology Exploitation Programme and involved collaboration with a major defence contractor.
The project covered the full design, manufacture, and qualification of QFNs built around GaN-based MMICs. Filtronic established a dedicated production line to support development, giving the company greater control over process integration and production capability. More than 150 units were manufactured and subjected to demanding tests, including moisture exposure at level five, 500 thermal cycles, and intensive electrical stress assessments.
“This project demonstrates the UK’s ability to deliver advanced GaN technologies at scale, while also proving the robustness of novel packaging approaches,” said Tudor Williams, Chief Technology Officer of Filtronic. “By pushing devices to their limits and validating their performance, we’ve taken a step forward in sovereign capability. This not only puts Filtronic at the forefront of GaN innovation but, crucially, strengthens the UK’s independence in critical semiconductor technology and secures its future in advanced defence, space and communication systems.”
All manufactured devices met electrical performance requirements, highlighting Filtronic’s progress in producing packaging solutions suited to next-generation defence and communications applications.
